Please request quotation
For Siplace F4 and F5
For flip chip bump centering
Field of view: 9 mm x 11.5 mm
Largest BE that can be processed in a single measurement: 7 mm x 9 mm
Smallest, reliably recognizable bump diameter: 0.1 mm
Reliable processing of IC grid: 0.25 mm
Condition: used, fully functional