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For Siplace F4 and F5
For flip chip bump centering
Field of view: 9 mm x 11.5 mm
Largest BE that can be processed in a single measurement: 7 mm x 9 mm
Smallest, reliably recognizable bump diameter: 0.1 mm
Reliable processing of IC grid: 0.25 mm
Condition: used, fully functional
Additional component vision module for Siplace 80F4 or F5 for flip chip bump centering.
Field of view: 9mm x 11.5mm
Largest flip chip with single measurement: 7 mm x 9 mm
Smallest, reliably recognizable bump diameter: 0.1 mm
Reliable processing of IC pitch: 0.25mm
condition: used, fully running